Detalhes do produto:
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Lugar de origem: | Zhuzhou |
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Marca: | Sanxin |
Certificação: | ISO 9001:2015 |
Número do modelo: | SX1254 |
Condições de Pagamento e Envio:
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Quantidade de ordem mínima: | 5 |
Tempo de entrega: | 5-25 dias |
Termos de pagamento: | L/C, T/T, Western Union |
Informação detalhada |
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Categoria: | Peças do molde do carboneto de tungstênio | Características: | Alta resistência ao desgaste, alta dureza, alta resistência |
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Tolerância: | ± 0,01 mm | Revestimento de superfície: | Polido |
Características: | Alta dureza | Tamanho: | Personalizado |
Aplicação: | Pequenas peças de trabalho de núcleo | Superfície: | Placas ou moedura lustrada |
material: | Carburo de tungsténio | Indústria: | Indústria de aparelhos eletrónicos |
Destacar: | Monolithic Tungsten Carbide Punch,Ultra-hard Core Tungsten Carbide Punch,Burr-free Tungsten Carbide Punch |
Descrição de produto
Burr-free Monolithic Tungsten Carbide Punch for Ultra-hard Core Precision Drilling
Introduction:
Adopting a step punch with integral sintered tungsten carbide (WC ≥ 94%), with a hardness of 92.5HRA and nanoscale transition rounded corners (R0.03mm), it breaks through the fracture bottleneck of traditional splicing punches and achieves precise piercing without burrs for millions of times in micro scale stamping fields such as electronic connectors, medical catheters, and lead frames.
Component | Content (wt.%) | Tolerance |
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WC (Tungsten Carbide) | 94% | ±0.5% |
Co (Cobalt) | 6% | ±0.3% |
Impurities (Total) | ≤0.5% | - |
Process:
1. Nano powder step molding
- Isostatic pressing gradient density control (deviation <0.3%)
- Graphite mold accuracy ±1μm (to prevent step deformation)
2. Low pressure SPS synchronous sintering
- Multi-temperature zone precise temperature control (1200℃±3℃)
- Grain boundary diffusion inhibition
3. Pulse electrolysis sharp edge strengthening
- Step transition R angle mirror polishing (Ra 0.02μm)
- Edge residual compressive stress +350MPa (anti-cracking ↑200%)
Application:
1. Precision manufacturing of electronics
- Lead frame: 0.1mm step hole punching (burr <5μm)
- Type-C interface terminal: 0.25mm special-shaped multi-level punching (position accuracy ±2μm)
- PCB plug-in pin: step countersunk hole forming (taper 30°±0.5°)
2. Medical device processing
- Heart stent laser cutting template (0.08mm step hole array)
- Minimally invasive surgical forceps riveting hole (double-stage transition without burr)
- Insulin needle guide hole (Φ0.15mm step expansion hole)
3. Precision mechanical core
- Fuel nozzle micro-hole step forming (roundness error <1μm)
- Clock gear shaft hole fine punching (coaxiality 0.003mm)
- Optical fiber connector ceramic ferrule (multi-level countersunk hole processing)
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